View MPXHZ6130A6U_685282.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Freescale Semiconductor Technical Data
MPXHZ6130A Rev 0, 07/2006
Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXHZ6130A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor's packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer. The MPXHZ6130A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * Resistant to High Humidity and Common Automotive Media * Improved Accuracy at High Temperature * 1.5% Maximum Error over 0 to 85C * Ideally suited for Microprocessor or Microcontroller-Based Systems * Temperature Compensated from -40 to +125C * Durable Thermoplastic (PPS) Surface Mount Package Typical Applications * Aviation Altimeters * Industrial Controls * Engine Control/Manifold Absolute Pressure (MAP) * Weather Station and Weather Reporting Devices ORDERING INFORMATION
Device Type
Basic Element Ported Element
MPXHZ6130A SERIES
INTEGRATED PRESSURE SENSOR 15 TO 130 kPa (2.2 TO 18.9 PSI) 0.2 TO 4.8 V OUTPUT SUPER SMALL OUTLINE PACKAGE
MPXHZ6130A6U CASE 1317-04
MPXHZ61630AC6U CASE 1317A-03
SUPER SMALL OUTLINE PACKAGE PIN NUMBERS(1)
1 2 3 4 N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the notch in the lead.
Options
Case No.
1317 1317
MPX Series Order No.
MPXHZ6130A6U MPXHZ6130A6T1
Packing Options
Rails
Device Marking
MPXHZ6130A
SUPER SMALL OUTLINE PACKAGE Absolute, Element Only Absolute, Element Only Absolute, Axial Port Absolute, Axial Port
Tape & Reel MPXHZ6130A Rails MPXHZ6130A
1317A MPXHZ6130AC6U
1317A MPXHZ6130AC6T1 Tape & Reel MPXHZ6130A
(c) Freescale Semiconductor, Inc., 2006. All rights reserved.
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
VOUT
GND
Pins 1, 5, 6, 7, and 8 are No Connects
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Output Source Current @ Full Scale Output(2) Output Sink Current @ Minimum Pressure Offset(2) Symbol Pmax Tstg TA Io + Io Value 400 -40 to +125 -40 to +125 0.5 -0.5 Units kPa C C mAdc mAdc
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
MPXHZ6130A 2 Sensors Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Pressure Range Supply Voltage(1) Supply Current Minimum Pressure Offset(2) @ VS = 5.0 Volts Full Scale Output(3) @ VS = 5.0 Volts Full Scale Span(4) @ VS = 5.0 Volts Accuracy(5) Sensitivity Response Time(6) Warm-Up Time(7) Offset Stability(8) 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25C due to all sources of error including the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. (0 to 85C) Symbol POP VS Io Voff Min 15 4.75 -- 0.132 Typ -- 5.0 6.0 0.200 Max 130 5.25 10 0.268 Unit kPa Vdc mAdc Vdc
(0 to 85C)
VFSO
4.632
4.700
4.768
Vdc
(0 to 85C)
VFSS
4.365
4.500
4.635
Vdc
(0 to 85C)
-- V/P tR -- --
-- -- -- -- --
-- 39.2 1.0 20 0.25
1.5 -- -- -- --
%VFSS mV/kPa ms ms %VFSS
MPXHZ6130A Sensors Freescale Semiconductor 3
. +5.0 V Die Wire Bond Lead Frame GND Pin 3 Absolute Element Sealed Vacuum Reference Die Bond P1 Stainless Steel Cap Thermoplastic Case VS Pin 2 100 nF MPXHZ6130A Vout Pin 4 47 pF 51 K to ADC
Fluoro Silicone Gel Die Coat
Figure 2. Cross Sectional Diagram SOP (Not to Scale)
Figure 3. Typical Application Circuit (Output Source Current Operation)
5.0 Transfer Function: 4.5 Vout =Vs x (0.007826 xP(kPa) - 0.07739) 4.0 +/- (PE x TM x Vs x 0.007826) Output (Volts) 3.5 PE = +/- 1.725kPa 3.0 TM = 1 @ 0 to 85C Vs = 5.0Vdc 2.5 2.0 1.5 1.0 0.5 60 0
MAX
MIN
TYP
100
110
120
130
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85C temperature range. The output will saturate outside of the rated pressure range. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application.
MPXHZ6130A 4 Sensors Freescale Semiconductor
140
10
20
30
40
50
70
80
90
Transfer Function (MPXHZ6130A)
Nominal Transfer Value: Vout = VS x (0.007826 x P(kPa) - 0.07739) (Pressure Error x Temp. factor x 0.007826 x VS) VS = 5.0 0.25 Vdc
Temperature Error Band
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20
MPXHZ6130A Series
Break Points Temp - 40 0 to 85 125 Multiplier 3 1 1.75
40
60
80
100
120
140
Temperature in C NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C
Pressure Error Band
3.0 2.0 Pressure Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 Pressure 15 to 130 (kPa) Error (Max) 1.725 (kPa) 20 40 60 80 100 120 Pressure (in kPa) Error Limits for Pressure
MPXHZ6130A Sensors Freescale Semiconductor 5
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a
0.050 1.27 TYP 0.150 3.81
solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.387 9.83
0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
PACKAGE DIMENSIONS
CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
MPXHZ6130A 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE
MPXHZ6130A Sensors Freescale Semiconductor 7
How to Reach Us:
Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2006. All rights reserved.
MPXHZ6130A Rev. 0 07/2006

▲Up To Search▲

Price & Availability of MPXHZ6130A6U

	To Download MPXHZ6130A6U Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .